C72500 Copper-nickel-tin alloy introduction
C72500 is widely used in electrical connectors, semiconductor lead frames, terminals, etc. in both signal and power systems. Cu Ni Sn is a modulated decomposition strengthening copper alloy, which has the advantages of high strength, high wear resistance, excellent stress relaxation resistance, and good conductivity. Widely used in the manufacturing of conductive and wear-resistant components such as bearings, bushings, bearing sleeves, high-power electronic components, precision plug-in terminals, etc.
| Grade | Chemical composition（%）≤ | Thickness (mm) |
||||||
| ASTM | EN | JIS | Cu | Ni | Sn | Mn | Other | 0.05-5.0 |
| C72500 | CuNi9Sn2 | C7250 | Balance | 8.5-10.5 | 1.8-2.8 | ≤0.2 | ≤1.0 | |
| Physical properties | ||||||||
| Density (g/cm³) |
Modulus of elasticity (GPa) |
Thermal expansion coefficient (×10-6/K) |
Electrical conductivity (%IACS) |
Thermal conductivity W(m·K) |
||||
| 8.8 | 120 | - | 15 | 80 | ||||
| Mechanical properties | Bend properties | |||||||
| Temper | Hardness HV |
Tension test | 90°R/T(Thick≤0.5mm) | |||||
| Tensile Strength Rm/MPa |
Yield Strength MPa |
Elongation % |
Good way | Bad way | ||||
| TB00 | 100-160 | 350-500 | 195-400 | ≥25 | - | - | ||
| TD04 | 170-260 | 700-850 | 550-700 | ≥6 | 1 | 1.5 | ||
| TD08 | 240-280 | 850-950 | 670-800 | ≥5 | 4 | 5 | ||
| TD12 | 260-320 | 900-1050 | ≥750 | ≥2 | - | - | ||
FAQ
Q: How long is your delivery time?
A: Generally it is within 15 days if the goods are in stock. or it is less than 30 days if the goods are not in stock, it is according to quantity.
Q: Do you provide samples ?
A: Yes, we could offer the sample.
Q: What ls your terms of payment？
A.30% T/T in advance ,balance before shipment. And the price depends on the material and the quantity.
If you have another question, please feel free to contact us.
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