C7025 is a copper nickel silicon alloy material, with the European standard grade CuNi3SiMg

Main spot thickness: 0.1/0.12/0.15/0.2/0.25/0.3/0.4/0.5/0.8mm.

Main spot status: TM02 TM03 TM04.

C7025 has excellent bending performance, high strength, good corrosion resistance, and excellent stress relaxation resistance.

The conventional conductivity is 45%, but in the TM00 state, its conductivity can reach over 50% or even higher.

In terms of processing performance: used in laser welding, cold processing, hot-dip plating, reflow electroplating, and chemical plating.

Maintain stable elastic performance in various application scenarios and meet the high requirements for material elasticity in products.