Adding elements such as Fe and P to the copper matrix gives C19400 moderate strength and elasticity, as well as excellent conductivity and stress relaxation resistance.
It is widely used in connectors, LED industry, stamping parts, electrical terminals, lead frames, automotive components and other fields.
At the same time, C19400 has successfully mass-produced hot-dip (physical electroplating) products, with tin layers ranging from 1 to 6 μ m.
| Grade | Chemical composition（%） | Thickness (mm) |
|||||
| GB | ASTM | JIS | Cu | Fe | P | Zn | 0.08-2.0 |
| TFe2.5 | C19400 | C1940 | Balance | 2.1-2.6 | 0.015-0.15 | 0.05-0.2 | |
| Physical properties | |||||
| Density (g/cm³) |
Modulus of elasticity (GPa) |
Thermal expansion coefficient (×10-6/K) |
Electrical conductivity (%IACS) |
Thermal conductivity W(m·K) |
|
| 8.91 | 121 | 16.3 | 60 | 260 | |
| Mechanical properties | Bend properties | ||||||
| Temper | Hardness HV |
Tension test | 90°R/T(Thick＜0.8mm) | 180°R/T(Thick＜0.8mm) | |||
| Tensile Strength Rm/MPa |
Elongation A11.3 % |
Good way | Bad way | Good way | Bad way | ||
| O60 | 90-110 | 300-380 | ≥20 | 0 | 0 | 0 | 0 |
| H01 | 100-120 | 320-400 | ≥15 | 0 | 0 | 0 | 0 |
| H02 | 115-135 | 365-430 | ≥6 | 0 | 0 | 1.5 | 2 |
| H04 | 125-145 | 410-490 | ≥5 | 1.5 | 1.5 | 2 | 2 |
| H06 | 135-150 | 450-500 | ≥3 | 1.5 | 2 | 2.5 | 3.5 |
| H08 | 140-155 | 480-530 | ≥2 | 2 | 3 | 2.5 | 4 |
| H10 | ≥145 | ≥500 | ≥2 | 2.5 | 3.5 | 3 | 4.5 |
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