Adding Sn, Ni, and other trace elements to copper as the matrix gives it high strength, elasticity, and excellent stress relaxation performance. Commonly used for lead frames, automotive terminals, connectors, etc.
| Grade | Chemical composition（%）≤ | Thickness (mm) |
|||||
| ASTM | Cu | Sn | Ni | P | Zn | Other | 0.1-3.0 |
| C19040 | Balance | 1.0-2.0 | 0.7-0.9 | 0.02-0.09 | 0.01-0.3 | ≤1.0 | |
| Physical properties | |||||||
| Density (g/cm³) |
Modulus of elasticity (GPa) |
Thermal expansion coefficient (×10-6/K) |
Electrical conductivity (%IACS) |
Thermal conductivity W(m·K) |
|||
| 8.9 | 130 | 17 | 30 | 140 | |||
| Mechanical properties | Bend properties | |||||
| Temper | Hardness HV |
Tension test | 90°R/T(Thick＜0.8mm) | |||
| Tensile Strength Rm/MPa |
Yield Strength MPa |
Elongation % |
Good way | Bad way | ||
| H04 | 155-180 | 500-590 | 480-565 | ≥8 | 0 | 0.5 |
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