By adding Sn, Ni, and other trace elements to the copper matrix, C19025 exhibits high strength, elasticity, and excellent stress relaxation performance, as well as excellent conductivity. It is applied to automotive terminals, connectors, etc.
| Grade | Chemical composition（%）≤ | Thickness (mm) |
|||||
| ASTM | Cu | Sn | Ni | P | Zn | 0.05-5.0 | |
| C19025 | Balance | 0.7-1.1 | 0.8-1.2 | 0.03-0.07 | ≤0.2 | ||
| Physical properties | |||||||
| Density (g/cm³) |
Modulus of elasticity (GPa) |
Thermal expansion coefficient (×10-6/K) |
Electrical conductivity (%IACS) |
Thermal conductivity W(m·K) |
|||
| 8.9 | 130 | 17 | 40 | 161 | |||
| Mechanical properties | Bend properties | |||||
| Temper | Hardness HV |
Tension test | 90°R/T(Thick≤0.5mm) | |||
| Tensile Strength Rm/MPa |
Yield Strength MPa |
Elongation % |
Good way | Bad way | ||
| H01 | 120-155 | 335-470 | 300-420 | ≥20 | 0 | 0 |
| H02 | 135-170 | 440-520 | 410-490 | ≥8 | 0 | 0 |
| H04 | 155-180 | 500-570 | 475-540 | ≥6 | 0 | 0 |
| H06 | 160-195 | 540-590 | 510-560 | ≥4 | 0 | 0.5 |
| H08 | 175-210 | 580-650 | 555-625 | ≥4 | - | - |
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