C14415 Copper-tin alloy introduction
C14415——Cu-Sn alloy, with conductivity similar to pure copper, has better mechanical and corrosion resistance properties, and is widely used as lead frame material for transistors (power integrated circuit chips), automotive water tanks, refrigeration fins, and switch sockets.
| Grade | Chemical composition（%） | Thickness (mm) |
||||||
| GB | ASTM | JIS | EN | Cu | Sn | 0.08-3.5 | ||
| TSn0.12 | C14415 | C1441 | CuSn0.15 | 99.96 | 0.10-0.15 | |||
| Physical properties | ||||||||
| Density (g/cm³) |
Modulus of elasticity (GPa) |
Thermal expansion coefficient (×10-6/K) |
Electrical conductivity (%IACS) |
Thermal conductivity W(m·K) |
||||
| 8.93 | 120 | 17.3 | 83 | 330 | ||||
| Mechanical properties | Bend properties | |||||||
| Temper | Vickers Hardness (HV) |
Tension test | 90°R/T (Thick≤0.5mm) | |||||
| Tensile Strength (MPa) |
Yield Strength (MPa) |
Elongation (%) |
Good way | Bad way | ||||
| R300 | 85-110 | 300-370 | ≥250 | ≥4 | 0.0 | 0.0 | ||
| R360 | 110-130 | 360-430 | ≥300 | ≥3 | 0.0 | 0.0 | ||
| R420 | 120-150 | 420-490 | ≥350 | ≥3 | 1.0 | 1.0 | ||
| R460 | ≥130 | ≥460 | ≥410 | - | 0.5 | 2.0 | ||
Studio practice focused on modern design, interiors landscapes from our inception.
EN
